Imbera takes on 3D packaging supply chain issues

While 3D IC integration folks are still scratching their heads trying to determine who will take on post-fab processes, over in the 3D packaging world Imbera has taken ownership of the supply chain issues facing the OSATS-to-PCB assembly end of the line for embedded active and passive technologies.

But let’s back up a bit. It’s well known that 3D configurations have existed in the packaging space for quite some time. In fact, package-on-package (PoP) options from the likes of Amkor, STATS ChipPAC, and ASE are already in volume production. Additionally, various embedded technologies such as the Fraunhofer’s chip-in-polymer (CiP), GE’s solderless “chips first” approach, IMEC’s ultra-thin chip package (UTCP), and Imbera’s integrated module board (IMB) technology all offer viable 3D technology solutions, at least in theory. Unfortunately, manufacturing these embedded 3D packages falls into that elusive “no-man’s-land” between OSATS and EMS providers, and therefore have been stalled at the “who’s-going-to-do-it” phase. (see: Executive Panel Addresses Options in WLP)

Luckily, thanks to USD $15M in series B funding from NorthZone Ventures, Index Ventures and Conor Venture Partners, Imbera is now positioned to do something about those pesky supply chain issues.

Risto Tuominen, CTO of Imbera, talked to me about the how the company intends to put the money to use. “There are lots of embedded technologies in development,” notes Tuominen, “but nobody is able to offer a full turnkey solution for an embedded technology supply chain.” Imbera’s intention is to merge packaging and PCB processes into one entity, beginning with a new high-volume manufacturing operation in Sangsong-ri, South Korea.

Although Japanese PCB manufacturer Ibiden licensed IMB technology in July 2008, Tuominen says the company’s focus over the last year has been to create its own manufacturing solutions. The goal is for the customers to provide the known-good die (KDG) and Imbera outputs the completed device - whether it is a QFN, BGA, system-in-package (SiP), or system-in-board (SIB).



The latest milestone was a joint venture (iDD) completed with Korean PCB manufacturer Daeduck in Q3 2008. “Daeduck offers a whole PCB infrastructure with proven capabilities in substrate and motherboard manufacturing.” He explained, “There’s a whole technology portfolio we can utilize.” It sure makes more sense than buying a PCB manufacturer. As part of the iDD joint venture, the new facility (owned 60% by Imbera and 40% by Daeduck) will be outfitted with new equipment.

The biggest question was how they managed to get funding now, given the current state of the industry and economy? For the past few years, Imbera has focused on developing a new business model, which included acquiring a new capital owner base in 2007; appointing a new CEO acquired in late 2007; and relaunching Imbera in early 2008, based on the new model. “We’re very fortunate to have the investors that we have,” said Tuominen, “We didn’t have to change a thing.”

That said, Tuominen was happy to share the secrets of Imbera’s success. He said it’s important to show a roadmap with technology improvements going forward, and that the benefits needed to be apparent from the outset. Everything must be of the highest quality, and that the customer can use it without changing existing infrastructure or design tools. “In the end, the technology needs to provide an efficient manufacturing solution,” he noted, “and you need to be able to show a cost reduction.”

But most importantly, rather than passing the buck, Imbera is taking ownership of the OSAT/PCB assembly bottleneck. Let’s hope other sectors of the 3D market find inspiration in this company’s achievements. – F.v.T

GBC 2009 - A 3D Packaging Junkie’s Dream

When I opened Lee Smith’s email yesterday to find the updated agenda for Spring 2009 IMAPS Global Business Council, I thought maybe I’d died and gone to 3D heaven. Called “Supply Chain Development for 3D Packaging”, the agenda for this one-day event preceding the Device Packaging Symposium is jam-packed with keynote-level speakers whose presentations span the 3D spectrum, giving air time to much more than the latest in TSV, although it certainly gets its due. Committee co-chairs, Lee Smith, VP of business development at Amkor, and Jie Xue, Ph.D. director of technology and quality at Cisco Systems, Inc. have done such a stellar job of putting together a content-rich program that I predict standing-room-only.

"I am very pleased with the overwhelming support we received from industry experts to speak at this event,” says Smith. “I've been involved with 3D packaging from folded flex assemblies to TSV interconnects over the past 28 years and believe this conference is a must-attend for anyone who is looking to develop, use or supply 3D IC, TSV or 3D packaging technologies.” He added that the GBC forum’s high level of speakers and attendees fosters open communication and is unique because rather than discussing technologies or products, the focus is placed on the business and logistics issues associated with developing a capable supply chain, which is critical to both users and suppliers.

This year Jan Vardaman, president, TechSearch International sets the tone with her keynote, “Market Demand, Applications, and Requirements for 3D Packaging and 3D ICs”. The morning session focuses on supply chain collaboration from R&D to commercialization of 3D ICs with TSVs beginning with "The Role of Consortia", featuring presentations by Rosalia Beica of EMC3D, and Eric Beyne of IMEC. Next, executives from several IC suppliers offer their perspectives. Among them, Bob Patti, of Tezzaron offers insight as an early supplier of 3D IC products, talking about obstacles his company faced due to lack of supply chain infrastructure.

During lunch, Bill McLean of IC Insights will offer a keynote on an upbeat topic, “Poised for Quick Rebound”. Hopefully this will help boost attendee optimism about the economic climate, or at least get us through desert without causing a room full of indigestion.

The afternoon is divided into two sessions, “3D Packaging, TSV, Roadmap, and Supply Chain/Technology Development” and “Multi-sources of Supply and Lessons Learned from 3D Packaging-based Products”. Here’s where other 3D flavors share the spotlight with TSV. Bill Bottoms of Nanonexus will talk about system-in-package (SiP) integration for 3D, Bob Lanzone of Amkor will unveil the company’s next-generation package-on-package (PoP) built on its proprietary through mold via (TMV) technology platform, and Marc Robinson, CTO of Vertical Circuits, will no doubt at least touch on the company’s jetted silver-filled polymer interconnect technology for chip stacking in his presentation, “Rolling Out a New Packaging Technology; Maximizing Supply Chain Opportunities.”

For maximum value, Smith recommends that technologists and business leaders consider coordinating their companies participation in the GBC and the two and a half days of strong 3D technical papers and exhibits that follow at the IMAPS Device Packaging Conference. “Within Amkor, we see the GBC and DPC as our top conference for 2009 participation; due to the quality of the topics, speakers, attendees," he says. "and of course our Arizona weather in March is a huge draw."

Let’s see, all the 3D I could possibly want to know about; a 3-day exchange of ice and snow for warm sunshine… I’ve heard enough. Come March 8-11, you know where to find me and my laptop. Hope to see you all there. – F.v.T