Françoise in 3D
Following the course of 3D IC integration and 3D Packaging
Monday, July 6, 2009
3D InCites: Unveiled
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Today, July 6, 2009, is the day a vision becomes a reality. When I first started Françoise in 3D , I knew it was just the beginning of somet...
Monday, June 29, 2009
SEMATECH: hitting 3D head-on
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At last week’s SEMATECH technology round-up webcast, Sitaram Arkalgud, director of 3D interconnect, made a comment about 3D technologies tha...
Friday, June 26, 2009
SUSS MicroTec: A 3D Approach
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It’s been a few years since I toured the US headquarters of SUSS MicroTec in Waterbury VT, so when general manager, Wilfried Bair invited me...
Thursday, June 25, 2009
Countdown to SEMICON West 2009
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With only 2.5 weeks to go (you're all saying, really? it's that close?) until SEMICON West, I can see the activity building around t...
Tuesday, June 23, 2009
3D companies address critical areas
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It’s only Tuesday, and already, it’s been a productive week for 3D news. Yesterday, SUSS and 3M announced an agreement in which SUSS become...
Monday, June 22, 2009
3D processes and approaches: stepping stones to market adoption
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I recently had one of those moments of clarity that comes from asking different people the same questions and fitting all the varied answers...
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Friday, June 19, 2009
Are you an oldtimer or a newcomer?
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It has nothing to do with age, and everything to do with whether you have the ability to embrace new and exciting things, or whether you dee...
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